Samsung Electro-Mechanics to Set Up Flip-Chip Substrate Facility in Korea
July 21, 2006
Samsung Electro-Mechanics recently announced it plans to set up a new flip-chip substrate production facility in Busan, Korea. The company stated it will invest approximately US$400 million in the facility, which is expected to start production before the end of 2008. Initial monthly production capacity is set at 15 million units.